Imikhiqizo
I-HDI engu-18 ye-telecom ene-oda elikhethekile lethusi
| Izendlalelo | 18 izendlalelo |
| Ukujiya kwebhodi | 1.58MM |
| Okubalulekile | FR4 tg170 |
| Ukujiya kwethusi | 0.5/1/1/0.5/ 0.5/1/1/0.5/0.5/1/1/0.5oz |
| I-Surface Qeda | ENIG Au Ukuqina0.05um;Ubukhulu obungu-3um |
| Imbobo encane(mm) | 0.203mm |
| Ububanzi Bolayini Obuncane(mm) | 0.1mm/4mil |
| Isikhala somugqa omncane(mm) | 0.1mm/4mil |
| I-Solder Mask | Okuhlaza |
| Umbala Wenganekwane | Emhlophe |
| Ukucutshungulwa komshini | I-V-scoring, CNC Milling(umzila) |
| Ukupakisha | Isikhwama se-Anti-static |
| I-E-test | I-Flying probe noma i-Fixture |
| Izinga lokwamukela | IPC-A-600H Ikilasi 2 |
| Isicelo | Ugesi wezimoto |
Isingeniso
I-HDI isifinyezo se-High-Density Interconnect.Kuyindlela eyinkimbinkimbi yokuklama ye-PCB.Ubuchwepheshe be-HDI PCB bunganciphisa amabhodi esekethe aphrintiwe emkhakheni we-PCB.Ubuchwepheshe buhlinzeka ngokusebenza okuphezulu kanye nokuminyana okukhulu kwezintambo namasekethe.
Ngendlela, amabhodi wesifunda we-HDI aklanywe ngokuhlukile kunamabhodi wesifunda aphrintiwe ajwayelekile.
Ama-HDI PCB anikwa amandla ngama-vias amancane, imigqa nezikhala.Ama-HDI PCB alula kakhulu, ahlobene eduze nokwenza kwawo okuncane.
Ngakolunye uhlangothi, i-HDI ibonakala ngokudluliswa kwefrikhwensi ephezulu, imisebe elawulwayo engafuneki, kanye nokuphazamiseka okulawulwayo ku-PCB.Ngenxa ye-miniaturization yebhodi, ukuminyana kwebhodi kuphezulu.
Ama-Microvias, ama-vias angaboni futhi angcwatshwe, ukusebenza okuphezulu, izinto ezisetshenziswayo ezincane nemigqa emihle konke kuyizimpawu zamabhodi esekethe aphrintiwe we-HDI.
Onjiniyela kufanele babe nokuqonda okuphelele komklamo kanye nenqubo yokukhiqiza ye-HDI PCB.Ama-Microchips kumabhodi wesifunda aphrintiwe we-HDI adinga ukunakwa okukhethekile kuyo yonke inqubo yomhlangano, kanye namakhono amahle kakhulu wokunamathisela.
Kumiklamo ehlangene njengamakhompyutha aphathekayo, omakhalekhukhwini, ama-HDI PCB mancane ngosayizi nesisindo.Ngenxa yobukhulu bawo obuncane, ama-HDI PCB nawo awathambekele kangako ekuqhekekeni.
HDI Vias
I-Vias izimbobo ku-PCB ezisetshenziselwa ukuxhuma ngogesi izendlalelo ezihlukene ku-PCB.Ukusebenzisa izendlalelo eziningi nokuzixhuma nge-vias kunciphisa usayizi we-PCB.Njengoba umgomo oyinhloko webhodi le-HDI ukunciphisa ubukhulu bayo, i-vias ingenye yezinto ezibaluleke kakhulu.Kunezinhlobo ezahlukene zokusebenzisa izimbobo.
Tumgodi nge
Idlula kuyo yonke i-PCB, kusukela kungqimba olungaphezulu kuya kwengaphansi, futhi ibizwa ngokuthi i-via.Kuleli qophelo, baxhuma zonke izingqimba zebhodi lesifunda eliphrintiwe.Kodwa-ke, i-vias ithatha isikhala esiningi futhi inciphisa indawo yengxenye.
Izimpumputhenge
I-Vis eyimpumputhe ivele ixhume isendlalelo sangaphandle kungqimba lwangaphakathi lwe-PCB.Asikho isidingo sokubhoboza yonke i-PCB.
Kungcwatshwe nge
Ama-vias angcwatshwe asetshenziselwa ukuxhuma izingqimba zangaphakathi ze-PCB.Ngezindlela ezingcwatshiwe azibonakali ngaphandle kwe-PCB.
I-Micronge
Ama-Micro vias amancane kakhulu ngosayizi ongaphansi kuka-6 ms.Udinga ukusebenzisa i-laser drilling ukuze wenze i-micro vias.Ngakho-ke, ama-microvias asetshenziselwa amabhodi we-HDI.Lokhu kungenxa yobukhulu bayo.Njengoba udinga ukuminyana kwengxenye futhi awukwazi ukumosha isikhala ku-HDI PCB, kuwukuhlakanipha ukufaka ama-microvias esikhundleni samanye avamile.Ukwengeza, ama-microvias awahlushwa yizinkinga zokunwetshwa kwe-thermal (CTE) ngenxa yemiphongolo yawo emifushane.
Isitaki
I-HDI PCB stack-up yinhlangano yesendlalelo ngesendlalelo.Inani lezendlalelo noma izitaki zinganqunywa njengoba kudingeka.Nokho, lokhu kungaba izingqimba ezingu-8 kuye kwezingama-40 noma ngaphezulu.
Kodwa inani eliqondile lezendlalelo lincike ekumineni kweminonjana.Ukupakishwa kwe-multilayer kungakusiza wehlise usayizi we-PCB.Futhi kunciphisa izindleko zokukhiqiza.
Ngendlela, ukucacisa inani lezendlalelo ku-HDI PCB, udinga ukunquma usayizi wokulandelela kanye namanetha kusendlalelo ngasinye.Ngemva kokuzikhomba, ungakwazi ukubala isitaki sesendlalelo esidingekayo ebhodini lakho le-HDI.
Amathiphu okuklama i-HDI PCB
1. Ukukhetha okunembile kwengxenye.Amabhodi e-HDI adinga isibalo samaphinikhodi aphezulu ama-SMD nama-BGA amancane kuno-0.65mm.Udinga ukuwakhetha ngokuhlakanipha njengoba athinta ngohlobo, ububanzi bokulandelela kanye nokupakisha kwe-HDI PCB.
2. Udinga ukusebenzisa ama-microvias ebhodini le-HDI.Lokhu kuzokuvumela ukuthi uthole kabili indawo ye-via noma enye.
3. Izinto ezisebenzayo nezisebenzayo kumele zisetshenziswe.Kubaluleke kakhulu ekwenziweni komkhiqizo.
4. Ukuze uthole indawo eyisicaba ye-PCB, kufanele ugcwalise izimbobo.
5. Zama ukukhetha izinto ezinezinga elifanayo le-CTE kuzo zonke izendlalelo.
6. Qaphela kakhulu ukuphathwa kwe-thermal.Qiniseka ukuthi uklama kahle futhi uhlela izendlalelo ezingasusa kahle ukushisa okukhulu.
