Imininingwane Yomkhiqizo
Izebele | Izendlalelo eziyi-8 |
Ukuqina kwebhodi | I-2.0mm |
Into uqobo lwayo | Fr4 TG170 |
Ubukhulu bethusi | 1/1/1/1/1/1/1/1 / 1 Oz (35um) |
Qeda phezulu | Ubukhulu be-enig au 0.05um; NI ubukhulu 3um |
Min Hole (MM) | I-0.203mm igcwele i-resin |
Ububanzi bemigqa yeminithi (mm) | 0.1mm / 4mil |
Isikhala se-Min Line (MM) | 0.1mm / 4mil |
Imaski yomthengisi | -Yimpatho |
Umbala we-legend | Okumhlophe |
Ukucutshungulwa kwemishini | I-V-CORES, CNC Milling (Umzila) |
Ukufaka ndawonye | Isikhwama se-Anti-Static |
Ukuhlola | Ukundiza kwendiza noma ukuhlanganiswa |
Ukwamukelwa okujwayelekile | I-IPC-A-600H CLASS 2 |
Isicelo | Izithuthi Zokwe-Electronive |
Ukuqalisa
I-HDI isifinyezo sokuxhumeka kobuningi obuphezulu. Kuyindlela eyinkimbinkimbi ye-PCB Design Technique. I-HDI PCB Technology ingancipha amabhodi wesifunda ephrintiwe enkambu ye-PCB. Ubuchwepheshe buhlinzeka ngokusebenza okuphezulu nobukhulu obukhulu bezintambo kanye nemibuthano.
By the way, amabhodi wesifunda Hdi enzelwe ngokuhlukile kunamabhodi wesifunda ajwayelekile aphrintiwe.
I-HDI PCBS inikwa amandla ngama-vias amancane, imigqa nezikhala. I-HDI PCBS ilula kakhulu, ehlobene kakhulu ne-miniaturhalization yabo.
Ngakolunye uhlangothi, i-HDI ibonakala ngokudluliswa kwemvamisa ephezulu, imisebe elahlekile elawulwayo, nokuvinjwa okulawulwayo kwi-PCB. Ngenxa ye-miniaturization yebhodi, iBhodi Huntity liphezulu.
I-Microvias, i-Vilind and Burged Vias, ukusebenza okuphezulu, izinto ezincanyana kanye nemigqa emihle zonke izikhalazo zamabhodi wesifunda e-HDI aphrintiwe.
Onjiniyela kumele babe nokuqonda ngokuphelele inqubo yokukhiqiza ye-Design ne-HDI PCB. Ama-Microchips kumabhodi wesifunda ephrintiwe aphrintiwe adinga ukunakwa okukhethekile kulo lonke inqubo yomhlangano, kanye namakhono amahle kakhulu wokuthengisa.
Kumiklamo ecwecwe elifana nama-laptops, izingcingo eziphathwayo, ama-PCI we-HDI ancanyana ngosayizi nesisindo. Ngenxa yobukhulu babo obuncane, ama-PCI we-HDI nawo athambekele ekuqhekekeni.
HDI Viaas
Vias yizimbobo ku-PCB ezisetshenziselwa ukuxhuma ugesi uxhume izingqimba ezahlukene ku-PCB. Usebenzisa izingqimba eziningi futhi uzixhumanisa ne-vias kunciphisa usayizi we-PCB. Njengoba inhloso enkulu yebhodi ye-HDI ukunciphisa usayizi wayo, i-vias ingesinye sezinto zayo ezibaluleke kakhulu. Kunezinhlobo ezahlukene zezimbobo.
Nge-hole nge
Idlula kuyo yonke i-PCB, ukusuka engxenyeni engaphezulu kuya engxenyeni engezansi, futhi ibizwa nge-via. Ngalesi sikhathi, baxhuma zonke izingqimba zebhodi yesekethe ephrintiwe. Kodwa-ke, i-Vias ithatha isikhala esithe xaxa futhi inciphise isikhala sengxenye.
Ungaboni nge
I-Blind Vias imane ixhume ungqimba lwangaphandle kungqimba lwangaphakathi le-PCB. Akunasidingo sokushayela yonke i-PCB.
Kungcwatshwe nge
Ama-vias angcwatshwe asetshenziselwa ukuxhuma izingqimba zangaphakathi ze-PCB. I-Viad Vias ayibonakali ngaphandle kwe-PCB.
Micro nge
I-Micro Vias iyinhle kakhulu ngosayizi ongaphansi kwama-6 amalokhi. Udinga ukusebenzisa ukumba kwe-laser ukwakha i-micro vias. Ngakho-ke ngokuyisisekelo, ama-microvias asetshenziselwa amabhodi we-HDI. Lokhu kungenxa yobukhulu bayo. Njengoba udinga ukuncipha kwengxenye futhi awukwazi ukuchitha isikhala kwi-PCB ye-HDI, kuwukuhlakanipha ukufaka enye i-vias ejwayelekile nge-microvias. Ngaphezu kwalokho, ama-microvias awahlushwa izindaba zokunwebeka okushisayo ngenxa yemiphongolo yawo emfushane.
Statup
I-HDI PCB Stack-Up yinhlangano ye-waler-by-ungqimba. Inani lezendlalelo noma izitaki zinganqunywa njengoba kudingeka. Kodwa-ke, lokhu kungaba izingqimba eziyi-8 eziya ezingxenyeni ezingama-40 noma ngaphezulu.
Kepha inani eliqondile lezendlalelo lincike ekubuthakathaka kwalomlandeli. Ukufakwa kwe-multilayer kungakusiza ukunciphisa usayizi we-PCB. Iphinde inciphise izindleko zokukhiqiza.
Ngendlela, ukuthola inani lezendlalelo ku-PCB ye-HDI, udinga ukunquma usayizi we-trace kanye namanetha kungqimba ngalinye. Ngemuva kokuhlonza, ungakwazi ukubala ukugcwala kwengqimba edingekayo ebhodini lakho le-HDI.
Amathiphu wokuqamba i-PCB ye-HDI
• Ukukhetha okuqondile kwengxenye. Amabhodi we-HDI adinga i-PIN Count SMDS ephezulu kanye ne-BGAS encane kune-0.65mm. Udinga ukuzikhethela ngobuhlakani njengoba zithinta ngohlobo, landelela ububanzi kanye ne-PCB PCB-up.
• Udinga ukusebenzisa ama-microvias ebhodini le-HDI. Lokhu kuzokuvumela ukuthi uthole ukuphinda kabili isikhala se-via noma okunye.
• Izinto ezisebenzayo futhi ezisebenzayo kufanele zisetshenziswe. Kubalulekile ekwenzeni umkhiqizo.
• Ukuthola indawo ye-PCB ecaba, kufanele ugcwalise izimbobo ze-Via.
• Zama ukukhetha izinto zokwakha ngenani elifanayo le-CTE yazo zonke izingqimba.
• Nakisisa ukuphathwa kwe-Thermal. Qiniseka ukuthi uklama kahle futhi uhlele izingqimba ezingahlukanisa kahle ukushisa ngokweqile.