Ikhasi_Banjaneri

Imikhiqizo

Impumputhe vias 8 harpe PCB

Impumputhe vias 8 harpe PCB

Izinto eziqinisekisiwe ze-Ul Certified Shengyi S30 FR4 FR4 Ubukhulu be-nI 3um. Ubuncane nge-0.203 mm bugcwele i-resin.

Intengo ye-FOB: US $ 1.5 / Piece

Inani le-oda le-Min (Moq): Ama-PC 1

Amandla okuhlinzekela: Ama-100,000,000 ama-PC ngenyanga

Imigomo Yokukhokha: I-T / T /, L / C, PayPal, Pathoneer

Indlela Yokuthumela: Ngoku-Express / nge Air / Ngasolwandle


Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Imininingwane Yomkhiqizo

Izebele Izendlalelo eziyi-8
Ukuqina kwebhodi I-2.0mm
Into uqobo lwayo Fr4 TG170
Ubukhulu bethusi 1/1/1/1/1/1/1/1 / 1 Oz (35um)
Qeda phezulu Ubukhulu be-enig au 0.05um; NI ubukhulu 3um
Min Hole (MM) I-0.203mm igcwele i-resin
Ububanzi bemigqa yeminithi (mm) 0.1mm / 4mil
Isikhala se-Min Line (MM) 0.1mm / 4mil
Imaski yomthengisi -Yimpatho
Umbala we-legend Okumhlophe
Ukucutshungulwa kwemishini I-V-CORES, CNC Milling (Umzila)
Ukufaka ndawonye Isikhwama se-Anti-Static
Ukuhlola Ukundiza kwendiza noma ukuhlanganiswa
Ukwamukelwa okujwayelekile I-IPC-A-600H CLASS 2
Isicelo Izithuthi Zokwe-Electronive

Ukuqalisa

I-HDI isifinyezo sokuxhumeka kobuningi obuphezulu. Kuyindlela eyinkimbinkimbi ye-PCB Design Technique. I-HDI PCB Technology ingancipha amabhodi wesifunda ephrintiwe enkambu ye-PCB. Ubuchwepheshe buhlinzeka ngokusebenza okuphezulu nobukhulu obukhulu bezintambo kanye nemibuthano.

By the way, amabhodi wesifunda Hdi enzelwe ngokuhlukile kunamabhodi wesifunda ajwayelekile aphrintiwe.

I-HDI PCBS inikwa amandla ngama-vias amancane, imigqa nezikhala. I-HDI PCBS ilula kakhulu, ehlobene kakhulu ne-miniaturhalization yabo.

Ngakolunye uhlangothi, i-HDI ibonakala ngokudluliswa kwemvamisa ephezulu, imisebe elahlekile elawulwayo, nokuvinjwa okulawulwayo kwi-PCB. Ngenxa ye-miniaturization yebhodi, iBhodi Huntity liphezulu.

I-Microvias, i-Vilind and Burged Vias, ukusebenza okuphezulu, izinto ezincanyana kanye nemigqa emihle zonke izikhalazo zamabhodi wesifunda e-HDI aphrintiwe.

Onjiniyela kumele babe nokuqonda ngokuphelele inqubo yokukhiqiza ye-Design ne-HDI PCB. Ama-Microchips kumabhodi wesifunda ephrintiwe aphrintiwe adinga ukunakwa okukhethekile kulo lonke inqubo yomhlangano, kanye namakhono amahle kakhulu wokuthengisa.

Kumiklamo ecwecwe elifana nama-laptops, izingcingo eziphathwayo, ama-PCI we-HDI ancanyana ngosayizi nesisindo. Ngenxa yobukhulu babo obuncane, ama-PCI we-HDI nawo athambekele ekuqhekekeni.

HDI Viaas

Vias yizimbobo ku-PCB ezisetshenziselwa ukuxhuma ugesi uxhume izingqimba ezahlukene ku-PCB. Usebenzisa izingqimba eziningi futhi uzixhumanisa ne-vias kunciphisa usayizi we-PCB. Njengoba inhloso enkulu yebhodi ye-HDI ukunciphisa usayizi wayo, i-vias ingesinye sezinto zayo ezibaluleke kakhulu. Kunezinhlobo ezahlukene zezimbobo.

8

Nge-hole nge

Idlula kuyo yonke i-PCB, ukusuka engxenyeni engaphezulu kuya engxenyeni engezansi, futhi ibizwa nge-via. Ngalesi sikhathi, baxhuma zonke izingqimba zebhodi yesekethe ephrintiwe. Kodwa-ke, i-Vias ithatha isikhala esithe xaxa futhi inciphise isikhala sengxenye.

Ungaboni nge

I-Blind Vias imane ixhume ungqimba lwangaphandle kungqimba lwangaphakathi le-PCB. Akunasidingo sokushayela yonke i-PCB.

Kungcwatshwe nge

Ama-vias angcwatshwe asetshenziselwa ukuxhuma izingqimba zangaphakathi ze-PCB. I-Viad Vias ayibonakali ngaphandle kwe-PCB.

Micro nge

I-Micro Vias iyinhle kakhulu ngosayizi ongaphansi kwama-6 amalokhi. Udinga ukusebenzisa ukumba kwe-laser ukwakha i-micro vias. Ngakho-ke ngokuyisisekelo, ama-microvias asetshenziselwa amabhodi we-HDI. Lokhu kungenxa yobukhulu bayo. Njengoba udinga ukuncipha kwengxenye futhi awukwazi ukuchitha isikhala kwi-PCB ye-HDI, kuwukuhlakanipha ukufaka enye i-vias ejwayelekile nge-microvias. Ngaphezu kwalokho, ama-microvias awahlushwa izindaba zokunwebeka okushisayo ngenxa yemiphongolo yawo emfushane.

Statup

I-HDI PCB Stack-Up yinhlangano ye-waler-by-ungqimba. Inani lezendlalelo noma izitaki zinganqunywa njengoba kudingeka. Kodwa-ke, lokhu kungaba izingqimba eziyi-8 eziya ezingxenyeni ezingama-40 noma ngaphezulu.

Kepha inani eliqondile lezendlalelo lincike ekubuthakathaka kwalomlandeli. Ukufakwa kwe-multilayer kungakusiza ukunciphisa usayizi we-PCB. Iphinde inciphise izindleko zokukhiqiza.

Ngendlela, ukuthola inani lezendlalelo ku-PCB ye-HDI, udinga ukunquma usayizi we-trace kanye namanetha kungqimba ngalinye. Ngemuva kokuhlonza, ungakwazi ukubala ukugcwala kwengqimba edingekayo ebhodini lakho le-HDI.

Amathiphu wokuqamba i-PCB ye-HDI

• Ukukhetha okuqondile kwengxenye. Amabhodi we-HDI adinga i-PIN Count SMDS ephezulu kanye ne-BGAS encane kune-0.65mm. Udinga ukuzikhethela ngobuhlakani njengoba zithinta ngohlobo, landelela ububanzi kanye ne-PCB PCB-up.

• Udinga ukusebenzisa ama-microvias ebhodini le-HDI. Lokhu kuzokuvumela ukuthi uthole ukuphinda kabili isikhala se-via noma okunye.

• Izinto ezisebenzayo futhi ezisebenzayo kufanele zisetshenziswe. Kubalulekile ekwenzeni umkhiqizo.

• Ukuthola indawo ye-PCB ecaba, kufanele ugcwalise izimbobo ze-Via.

• Zama ukukhetha izinto zokwakha ngenani elifanayo le-CTE yazo zonke izingqimba.

• Nakisisa ukuphathwa kwe-Thermal. Qiniseka ukuthi uklama kahle futhi uhlele izingqimba ezingahlukanisa kahle ukushisa ngokweqile.


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