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PCB Assembly Equipment

I-ANKE PCB inikezela ngohlu olukhulu lwemishini ye-SMT ehlanganisa amaphrinta e-stencil ashintshwayo, azenzakalelayo futhi azenzakalelayo, imishini yokukhetha nendawo kanye nebhentshi yebhentshi kanye nohhavini ogeleza kabusha abaphansi kuya kwamaphakathi ukuze bahlanganiswe phezulu.

Kwa-ANKE PCB siyiqonda ngokugcwele ikhwalithi iwumgomo oyinhloko wokuhlanganisa i-PCB futhi sikwazi ukufeza indawo esezingeni eliphezulu ethobela ukwakhiwa kwe-PCB yakamuva nemishini yokuhlanganisa.

Isilayishi se-PCB esizenzakalelayo

Lo mshini uvumela amabhodi we-pcb ukuthi adle emshinini wokuphrinta wokunamathisela we-solder othomathikhi.

Inzuzo

• Ukongela abasebenzi isikhathi

• Ukonga izindleko ekukhiqizeni umhlangano

• Ukunciphisa iphutha elingaba khona elizobangelwa imanuwali

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Iphrinta ye-Automatic Stencil

I-ANKE inemishini yokuphrinta ye-stencil ezenzakalelayo.

• Kuyahleleka

• Uhlelo lwe-Squeegee

• Isistimu ye-stencil yokumisa okuzenzakalelayo

• Uhlelo lokuhlanza oluzimele

• Ukudluliswa kwe-PCB nohlelo lokuma

• Isixhumi esibonakalayo esisebenziseka kalula esenziwe ngesintu isiNgisi/isiShayina

• Isistimu yokuthwebula isithombe

• Ukuhlolwa kwe-2D ne-SPC

• Ukuhlelwa kwestencil se-CCD

• Ukulungiswa kokuqina kwe-PB okuzenzakalelayo

Imishini Yokukhetha & Indawo ye-SMT

• Ukunemba okuphezulu nokuvumelana nezimo okuphezulu kuka-01005, 0201, SOIC, PLCC, BGA, MBGA, CSP, QFP, kufika ku-0.3mm

• Isistimu yesifaki khodi somugqa ongathinteki ukuze uphindaphindeke futhi uzinze

• Isistimu yokuphakelayo ehlakaniphile ihlinzeka ngokuhlola indawo yokuphakelayo okuzenzakalelayo, ukubala okuzenzakalelayo kwengxenye, ukulandelelwa kwedatha yokukhiqiza

• Ilungele ukukhiqizwa kwevolumu encane naphakathi

• Isistimu yokuqondanisa ye-COGNEX "Vision on the Fly"

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• Isistimu yokuqondanisa umbono ongezansi yephimbo elihle le-QFP & BGA

• Isistimu yekhamera eyakhelwe ngaphakathi ene-auto smart fiducial mark yokufunda

• Uhlelo lwe-dispenser

• Ukuhlolwa kombono ngaphambi nangemuva kokukhiqiza

• Ukuguqulwa kwe-Universal CAD

• Izinga lokubeka: 10,500 cph (IPC 9850)

• Amasistimu ngezikrufu zebhola kuma-X- kanye no-Y-axes

• Ifanele i-160 intelligent auto tape feeder

Umshini Wokuthungela Kabusha Ongaholelekile/Umshini Wokuthungela Kabusha Ongaholelekile Ongaholelekile

•Isoftware yokusebenza yeWindows XP enezinye izindlela zesiShayina nesiNgisi.Lonke uhlelo ngaphansi

ukulawula ukuhlanganisa kungahlaziya futhi kubonise ukwehluleka.Yonke idatha yokukhiqiza ingagcinwa ngokuphelele futhi ihlaziywe.

• Iyunithi yokulawula ye-PC&Siemens PLC esebenza ngokuzinzile;ukunemba okuphezulu kokuphindaphinda kwephrofayili kungagwema ukulahleka komkhiqizo okubangelwa ukusebenza okungavamile kwekhompyutha.

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Idizayini eyingqayizivele ye-convection eshisayo yezindawo zokushisa ezivela ezinhlangothini ezingu-4 inikeza ukusebenza kahle kokushisa okuphezulu;umehluko wezinga eliphezulu lokushisa phakathi kwezindawo ezihlangene ezingu-2 ungagwema ukuphazamiseka kwezinga lokushisa;Ingafinyeza umehluko wezinga lokushisa phakathi kosayizi omkhulu nezincane futhi ihlangabezane nesidingo sokusoda se-PCB eyinkimbinkimbi.

• Ukupholisa komoya okuphoqiwe noma isibandisi sokupholisa amanzi esinesivinini esisebenzayo sokupholisa sifanelana nazo zonke izinhlobo zokunamathisela okunamathelisa okusoda okunomthofu.

• Ukusetshenziswa kwamandla okuphansi (8-10 KWH/ihora) ukuze wonge izindleko zokukhiqiza.

I-AOI (Isistimu Yokuhlola Okuzenzakalelayo)

I-AOI iyithuluzi elithola izinkinga ezivamile ekukhiqizweni kokushisela ngokusekelwe kumigomo yokubona.I-AOl iwubuchwepheshe bokuhlola obusafufusa, kodwa bukhula ngokushesha, futhi abakhiqizi abaningi bethule imishini yokuhlola i-Al.

Ngesikhathi sokuhlola okuzenzakalelayo, umshini uskena ngokuzenzakalelayo i-PCBA ngekhamera, uqoqe izithombe, futhi uqhathanise amajoyinti e-solder atholiwe namapharamitha afanelekayo kusizindalwazi.Ukulungisa umlungisi.

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Ubuchwepheshe bokucubungula umbono obunesivinini esikhulu, obunembayo busetshenziswa ukuze kutholwe ngokuzenzakalelayo amaphutha ahlukahlukene okubeka kanye neziphambeko zokunamathisela ebhodini le-PB.

Amabhodi e-PC asukela emabhodini ane-high-density board kuya kumabhodi anosayizi ophansi anobukhulu obuncane, ahlinzeka ngezixazululo zokuhlola okusemgqeni ukuze kuthuthukiswe ukusebenza kahle kokukhiqiza kanye nekhwalithi ye-solder.

Ngokusebenzisa i-AOl njengethuluzi lokunciphisa isici, amaphutha angatholwa futhi aqedwe ekuqaleni kwenqubo yokuhlanganisa, okuholela ekulawuleni okuhle kwenqubo.Ukutholwa kusenesikhathi kokulimala kuzovimbela amabhodi amabi ukuthi athunyelwe ezigabeni zokuhlanganisa ezilandelayo.I-AI izonciphisa izindleko zokulungisa futhi igweme ukuchithwa kwamabhodi ngendlela engenakulungiseka.

I-3D X-Ray

Ngokuthuthuka okusheshayo kobuchwepheshe be-elekthronikhi, ukwenziwa kancane kancane kokupakishwa, ukuhlangana kwabantu abaningi, kanye nokuvela okuqhubekayo kobuchwepheshe obusha bokupakisha obuhlukahlukene, izidingo zekhwalithi yomhlangano wesifunda ziya ngokuya zikhuphuka.

Ngakho-ke, izidingo eziphakeme zibekwe ezindleleni zokuthola nobuchwepheshe.

Ukuze kuhlangatshezwane nalesi sidingo, ubuchwepheshe obusha bokuhlola buvela njalo, futhi ubuchwepheshe bokuhlola i-X-ray obuzenzakalelayo be-3D bungummeleli ojwayelekile.

Ayikwazi ukubona kuphela amajoyinti e-solder angabonakali, njenge-BGA (I-Ball Grid Array, iphakheji ye-ball grid array), njll., kodwa futhi yenza ukuhlaziya okunekhwalithi nokwenani kwemiphumela yokuthola ukuze kutholwe amaphutha kusenesikhathi.

Njengamanje, kusetshenziswe amasu anhlobonhlobo okuhlola emkhakheni wokuhlolwa komhlangano we-elekthronikhi.

Izinto ezisetshenziswayo ezijwayelekile wukuhlola okubukwayo okwenziwa ngesandla (MVI), isihloli esingaphakathi kwesifunda (ICT), kanye ne-Automatic Optical.

Ukuhlola (Ukuhlola Okuzenzakalelayo Kwamehlo).I-AI), Ukuhlola I-X-ray Okuzenzakalelayo (AXI), Umhloli Osebenzayo (FT) njll.

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PCBA Rework Station

Ngokuqondene nenqubo yokusetshenzwa kabusha kwawo wonke umhlangano we-SMT, ingahlukaniswa ngezinyathelo ezimbalwa njengokudiliza, ukubunjwa kabusha kwengxenye, ukuhlanzwa kwephedi le-PCB, ukubekwa kwengxenye, ukushisela, nokuhlanza.

1. I-Desoldering: Le nqubo iwukukhipha izingxenye ezikhandiwe ku-PB yezingxenye ezingashintshi ze-SMT.Umgomo oyisisekelo kakhulu awukona ukulimaza noma ukulimaza izingxenye ezisusiwe ngokwazo, izingxenye ezizungezile namaphedi e-PCB.

2. Ukubunjwa kwengxenye: Ngemva kokuba izingxenye ezisetshenziswe kabusha zichithwa, uma ufuna ukuqhubeka nokusebenzisa izingxenye ezisusiwe, kufanele ulungise kabusha izingxenye.

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3. Ukuhlanzwa kwephedi ye-PCB: Ukuhlanzwa kwephedi ye-PCB kuhlanganisa ukuhlanzwa kwephedi nomsebenzi wokuqondanisa.Ukulinganisa kwephedi kuvame ukubhekisa ekulevelini kwendawo yephedi ye-PCB yedivayisi ekhishiwe.Ukuhlanza amaphedi kuvame ukusebenzisa i-solder

Ithuluzi lokuhlanza, elifana ne-soldering iron, lisusa i-solder esele kumaphedi, bese lisula ngotshwala obuphelele noma isincibilikisi esigunyaziwe ukuze kukhishwe izinhlawulo nezingxenye ezisele zokuguquguquka.

4. Ukubekwa kwezingxenye: hlola i-PCB esenziwe kabusha ngokunamathisela kwe-solder ephrintiwe;sebenzisa idivayisi yokubeka ingxenye yesiteshi sokusebenza kabusha ukuze ukhethe i-vacuum nozzle efanele futhi ulungise i-PCB yokuphinda ibekwe.

5. I-Soldering: Inqubo ye-soldering yokuphinda isetshenziswe kabusha ingahlukaniswa ibe i-soldering manual kanye ne-reflow soldering.Kudinga ukucatshangelwa ngokucophelela okusekelwe engxenyeni kanye nezakhiwo zesakhiwo se-PB, kanye nezakhiwo zezinto zokushisela ezisetshenzisiwe.I-welding ye-manual ilula futhi isetshenziselwa ukushisela kabusha izingxenye ezincane.

Umshini Wokuthungatha wamagagasi Ongaholelekile

• Isikrini sokuthinta + iyunithi yokulawula ye-PLC, ukusebenza okulula nokuthembekile.

• Idizayini ethuthukisiwe yangaphandle, idizayini yemodyuli yangaphakathi, ayinhle nje kuphela kodwa futhi kulula ukuyinakekela.

• I-flux sprayer ikhiqiza i-atomization enhle ngokusetshenziswa okuphansi kwe-flux.

• I-turbo fan exhaust enekhethini elivikelayo ukuvimbela ukusakazeka kokugeleza kwe-athomu endaweni yokushisa kwangaphambili, ukuqinisekisa ukusebenza okuphephile.

• Ukushisa kwe-heater kwe-modularized kulungele ukulungiswa;Ukulawula ukushisa kwe-PID, izinga lokushisa elizinzile, ijika elibushelelezi, ukuxazulula ubunzima benqubo yokungenamthofu.

• Amapani e-solder asebenzisa amandla aphezulu, insimbi engagugi engagugi akhiqiza ukusebenza kahle kokushisa okuphezulu.

• Imibhobho eyenziwe nge-titanium iqinisekisa ukuwohloka kokushisa okuphansi kanye ne-oxidation ephansi.

• Inomsebenzi wokuqalisa okunesikhathi okuzenzakalelayo nokuvalwa kwawo wonke umshini.

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Isikhathi sokuthumela: Sep-05-2022