| Umthamo webhodi eliqinile | |
| Inombolo yezendlalelo: | 1-42 izingqimba |
| Okubalulekile: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Ugqinsi lwe-Cu lwesendlalelo sangaphandle: | 1-6OZ |
| Ugqinsi lwe-Cu yangaphakathi: | 1-4OZ |
| Indawo ephezulu yokucubungula: | 610*1100mm |
| Ubuncane bebhodi ukujiya: | 2 izendlalelo 0.3mm (12mil) |
| 4 izendlalelo 0.4mm (16mil) | |
| 6 izendlalelo 0.8mm (32mil) | |
| 8 izendlalelo 1.0mm (40mil) | |
| 10 izendlalelo 1.1mm (44mil) | |
| 12 izendlalelo 1.3mm (52mil) | |
| 14 izendlalelo 1.5mm (59mil) | |
| 16 izendlalelo 1.6mm (63mil) | |
| Ububanzi obuncane: | 0.076mm (3mil) |
| Ubuncane besikhala: | 0.076mm (3mil) |
| Ubuncane bosayizi wembobo (imbobo yokugcina): | 0.2mm |
| Ukubukeka kwesilinganiselo: | 10:01 |
| Usayizi wembobo yokubhoboza: | 0.2-0.65mm |
| Ukubekezelela ukumba: | +\-0.05mm(2mil) |
| Ukubekezelelwa kwe-PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) |
| Φ1.6-6.3mm+\-0.1mm(4mil) | |
| Ukubekezelelana kwe-NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) |
| Φ1.6-6.3mm+\-0.05mm(2mil) | |
| Qedela ukubekezelela ibhodi: | Ubukhulu＜0.8mm, Ukubekezelelana:+/-0.08mm |
| 0.8mm≤Ukuqina≤6.5mm,Ukubekezelela+/-10% | |
| Ubuncane bebhuloho le-soldermask: | 0.076mm (3mil) |
| Ukusonta nokugoba: | ≤0.75% Min0.5% |
| Uhlu lwe-TG: | 130-215 ℃ |
| Ukubekezelela Impedance: | +/-10%, Amaminithi+/-5% |
| Ukwelashwa kwendawo: | HASL, LF HASL |
| Igolide lokucwiliswa, i-Flash Gold, umunwe wegolide | |
| Isiliva Sokucwiliswa, Ithini Yokucwiliswa, i-OSP | |
| I-Selective Gold Plating, ukujiya kwegolide kufika ku-3um(120u") | |
| I-Carbon Print, I-Peelable S/M, ENEPIG | |
| Aluminium board umthamo | |
| Inombolo yezendlalelo: | Isendlalelo esisodwa, izingqimba ezimbili |
| Ubukhulu bosayizi webhodi: | 1500*600mm |
| Ubukhulu bebhodi: | 0.5-3.0mm |
| Ugqinsi lwethusi: | 0.5-4oz |
| Ubuncane bosayizi wembobo: | 0.8mm |
| Ububanzi obuncane: | 0.1mm |
| Isikhala esincane: | 0.12mm |
| Ubuncane bukasayizi wephedi: | 10 micron |
| Ukuqedwa kobuso: | I-HASL, OSP, ENIG |
| Ukubumba: | CNC, Punching, V-cut |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
| Amandla we-FPC | |
| Izendlalelo: | 1-8 izendlalelo |
| Ubukhulu bebhodi: | 0.05-0.5mm |
| Ugqinsi lwethusi: | 0.5-3OZ |
| Ububanzi obuncane: | 0.075mm |
| Isikhala esincane: | 0.075mm |
| Ngosayizi wembobo: | 0.2mm |
| Ubuncane bosayizi wembobo ye-laser: | 0.075mm |
| Ubuncane bosayizi wembobo yokubhoboza: | 0.5mm |
| Ukubekezelelana kwe-Soldermask: | +\-0.5mm |
| Ubuncane bokubekezelela ubukhulu bomzila: | +\-0.5mm |
| Ukuqedwa kobuso: | I-HASL,LF HASL, Isiliva Lokucwiliswa, Igolide Lokucwiliswa, I-Flash Gold, i-OSP |
| Ukubumba: | Ukubhoboza, i-laser, ukusika |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
| Umthamo oqinile & oguqukayo | |
| Izendlalelo: | 1-28 izingqimba |
| Uhlobo lwezinto: | FR-4(High Tg, Halogen Free, High Frequency) |
| PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | |
| Ubukhulu bebhodi: | 6-240mil/0.15-6.0mm |
| Ugqinsi lwethusi: | 210um (6oz) wesendlalelo sangaphakathi esingu-210um (6oz) sesendlalelo sangaphandle |
| Usayizi omncane wokubhoboza womshini: | 0.2mm/0.08” |
| Ukubukeka kwesilinganiselo: | 2:01 |
| Ubukhulu bosayizi wephaneli: | Uhlangothi olulodwa noma izinhlangothi ezimbili: 500mm * 1200mm |
| Izendlalelo Zezendlalelo Eziningi:508mm X 610mm (20″ X 24″) | |
| Ububanzi/isikhala somugqa omncane: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Ngohlobo lwembobo: | Impumputhe / Yangcwatshwa / Ixhunyiwe(VOP,VIP…) |
| HDI / Microvia: | YEBO |
| Ukuqedwa kobuso: | HASL, LF HASL |
| Igolide lokucwiliswa, i-Flash Gold, umunwe wegolide | |
| Isiliva Sokucwiliswa, Ithini Yokucwiliswa, i-OSP | |
| I-Selective Gold Plating, ukujiya kwegolide kufika ku-3um(120u") | |
| I-Carbon Print, I-Peelable S/M, ENEPIG | |
| Ukubumba: | CNC, Punching, V-cut |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
Isikhathi sokuthumela: Sep-05-2022
