manfactyre

I-Surface Mount Technology (SMT): Ubuchwepheshe bokucubungula amabhodi e-PCB angenalutho kanye nokufaka izingxenye ze-elekthronikhi ebhodini le-PCB.Lobu ubuchwepheshe bokucutshungulwa kwe-elekthronikhi obudume kakhulu kulezi zinsuku ezinezingxenye ze-elekthronikhi ziya ziba zincane kanye nokuthambekela kokushintsha kancane kancane ubuchwepheshe be-plug-in ye-DIP.Bobabili ubuchwepheshe bungasetshenziswa ebhodini elifanayo, ngobuchwepheshe be-thru-hole obusetshenziselwa izingxenye ezingafanele ukukhwezwa ngaphezulu njengama-transformer amakhulu nama-semiconductors amandla acwilisiwe.

Ingxenye ye-SMT ivamise ukuba yincane kunozakwabo we-thru-hole ngoba inomkhondo omncane noma ayinawo nhlobo umkhondo.Ingase ibe nezikhonkwane ezimfushane noma imikhondo yezitayela ezihlukahlukene, othintana nabo abayisicaba, i-matrix yamabhola e-solder (ama-BGA), noma ukunqanyulwa emzimbeni wengxenye.

Izici ezikhethekile:

>Umshini wokukhetha isivinini esikhulu & umshini wokumisa wonke ama-SMT amancane, aphakathi nendawo kuya komkhulu (SMTA).

> Ukuhlolwa kwe-X-ray kwe-SMT Assembly yekhwalithi ephezulu (SMTA)

>Umugqa wokuhlanganisa ubeka ukunemba +/- 0.03 mm

>Phatha amaphaneli amakhulu afika ku-774 (L) x 710 (W) mm ngosayizi

>Phatha usayizi wezingxenye ukuya ku-74 x 74, Ubude bufika ku-38.1 mm ngosayizi

>Umshini wokukhetha nokubeka we-PQF usinika ukuguquguquka okwengeziwe kokugijima okuncane kanye nokwakhiwa kwebhodi lesibonelo.

>Yonke i-PCB assembly (PCBA) ilandelwa yi-IPC 610 class II standard.

>Umshini wokukhetha nokubeka we-Surface Mount Technology (SMT) usinika amandla okusebenza ngephakheji yengxenye ye-Surface Mount Technology (SMT) encane kuno-01 005 engusayizi ongu-1/4 wengxenye engu-0201.