Imikhiqizo
I-Microwave Power amplifier PCB Assembly eChina
| Izendlalelo | 10 izendlalelo |
| Ukujiya kwebhodi | 1.6MM |
| Okubalulekile | I-ITEQ IT-180A FR-4(TG≥170℃) |
| Ukujiya kwethusi | 1oz(35um) |
| I-Surface Qeda | ENIG Au Ukuqina 0.8um;Ubukhulu obungu-3um |
| Imbobo encane(mm) | 0.13mm |
| Ububanzi Bolayini Obuncane(mm) | 0.15mm |
| Isikhala somugqa omncane(mm) | 0.15mm |
| I-Solder Mask | Okubomvu |
| Umbala Wenganekwane | Emhlophe |
| Usayizi webhodi | 132*127mm |
| Ukuhlanganiswa kwe-PCB | Inhlanganisela ye-surface mount ehlanganisiwe nhlangothi zombili |
| I-ROHS ithobele | Hola inqubo yokuhlanganisa YAMAHHALA |
| Ubuncane bosayizi wezingxenye | 0201 |
| Isamba sezingxenye | 1126 ibhodi ngalinye |
| Iphakethe le-IC | BGA, QFN |
| I-IC eyinhloko | Texas Instruments, SIMCOM,On Semiconductor, Farichild,NXP,ST |
| Isivivinyo | I-AOI, i-X-ray, Ukuhlolwa Okusebenzayo |
| Isicelo | Ugesi wezimoto |
Inqubo Yomhlangano we-SMT
1. Indawo (ukwelapha)
Indima yayo ukuncibilikisa i-patch glue ukuze izingxenye zokukhweza ezingaphezulu kanye nebhodi le-PCB kuhlanganiswe ngokuqinile ndawonye.
Izinto ezisetshenziswayo ihhavini elaphayo, etholakala ngemuva komshini wokubeka kulayini we-SMT.
2. Ukuphinda kufakwe i-soldering
Indima yayo ukuncibilikisa unamathisele we-solder, ukuze izingxenye ze-surface mount kanye nebhodi le-PCB kuhlanganiswe ngokuqinile ndawonye.Izinto ezisetshenziswayo kwakuyi-oven reflow, etholakala ngemuva kwamaphedi.
I-Mounter kulayini wokukhiqiza we-SMT.
3. Ukuhlanza umhlangano we-SMT
Ekwenzayo ukususa izinsalela ze-solder ezifana no-ux
I-PCB ehlanganisiwe iyingozi emzimbeni womuntu.Impahla esetshenziswa umshini wokuwasha, indawo kungaba
Ayilungisiwe, ingase ibe ku-inthanethi noma ingaxhunyiwe ku-inthanethi.
4. Ukuhlolwa komhlangano we-SMT
Umsebenzi wayo ukuhlola izinga lokushisela kanye nekhwalithi yokuhlanganisa
Ibhodi le-PCB elihlanganisiwe.
Izinto ezisetshenziswayo zihlanganisa ingilazi yokukhulisa, isibonakhulu, isihloli esingaphakathi kwesifunda (ICT), isihloli senaliti, ukuhlola okuzenzakalelayo (AOI), uhlelo lokuhlola lwe-X-RAY, umhloli osebenzayo, njll.
5. Ukuhlelwa kabusha komhlangano we-SMT
Iqhaza layo wukulungisa kabusha ibhodi le-PCB elihlulekile
Iphutha.Amathuluzi asetshenziswayo yi-soldering iron, i-rework station, njll.
noma yikuphi kulayini wokukhiqiza.Njengoba wazi, kunezinkinga ezincane ngesikhathi sokukhiqiza, ngakho-ke ukuhlangana kabusha kwezandla kuyindlela engcono kakhulu.
6. Ukupakishwa komhlangano we-SMT
I-PCBMay ihlinzeka ngokuhlanganisa, ukupakishwa ngokwezifiso, ukulebula, ukukhiqizwa kwegumbi elihlanzekile, ukuphathwa kokuvala inzalo nezinye izixazululo ukuze kunikeze isisombululo esiphelele sangokwezifiso sezidingo zenkampani yakho.
Ngokusebenzisa okuzenzakalelayo ukuze sihlanganise, sihlanganise futhi siqinisekise imikhiqizo yethu, singanikeza amakhasimende ethu inqubo yokukhiqiza enokwethenjelwa nesebenza ngempumelelo.
Ngesipiliyoni seminyaka engaphezu kwe-10 njengomhlinzeki wesevisi yokukhiqiza ngogesi weTelecommunication, thina i-ANKE sisekela amadivayisi ahlukahlukene kanye nezivumelwano zokuxhumana ngocingo:
> Imishini yekhompyutha nemishini
> Amaseva namarutha
> I-RF & Microwave
> Izikhungo zedatha
> Gcina idatha
> Imishini ye-Fiber optic
> Ama-Transceivers nama-transmitters
Umhlinzeki wesevisi yokukhiqiza ngogesi Wezimoto, sifaka izicelo eziningi:
> Umkhiqizo wekhamera yezimoto
> Izinzwa zokushisa nomswakama
> Isibani esikhulu
> Ukukhanyisa okuhlakaniphile
> Amamojula wamandla
> Izilawuli zeminyango nezibambo zeminyango
> Amamojula okulawula umzimba
> Ukuphathwa kwamandla
