IzimboboI-PCBIngahlukaniswa ibe yi-Purted ngokusebenzisa izimbobo (pth) futhi ingaphathwa nge-holes (NPTH) ngokususelwa uma inokuxhunyaniswa ngogesi.
I-Pulated ngomgodi (Pth) ibhekisa emgodini ngenhlanganisela yensimbi ezindongeni zayo, ezingafinyelela ukuxhumana kagesi phakathi kwamaphethini okuqhutshwa ngaphakathi, ungqimba lwangaphandle, noma zombili ze-PCB. Usayizi wayo unqunywa ngosayizi womgodi obiziwe kanye nobukhulu bengqimba ebekiwe.
Okungafakwanga ngezimbobo (i-NPTH) yizimbobo ezingazibandakanyi ekuxhumeni kukagesi kwe-PCB, eyaziwa nangokuthi izimbobo ezingezinhle zensimbi. Ngokusho kongqimba ongena emgodini ungene ku-PCB, izimbobo zingahlukaniswa njengomgodi, zingcwatshwe nge-via / hole, futhi ziyimpumputhe nge / hole.
Nge-Holos ingena kwi-PCB yonke futhi ingasetshenziselwa ukuxhumeka kwangaphakathi kanye / noma ukuma nokubekwa kanye nokubekwa kwezakhi. Phakathi kwazo, izimbobo ezisetshenziselwa ukulungiswa kanye / noma ukuxhumana ngogesi ngama-terminals anengxenye (kufaka phakathi izikhonkwane nezintambo) kwi-PCB zibizwa ngokuthi izimbobo zento. I-Purted ngokusebenzisa-izimbobo ezisetshenziselwa ukuxhumana kwezendlalelo zangaphakathi kepha ngaphandle kokukhuphuka kwengxenye yezakhi noma ezinye izinto zokuqinisa zibizwa nge-HOLES. Kunezinhloso ezimbili ikakhulukazi zokumba izimbobo ku-PCB: One ukudala ukuvula ibhodi, ukuvumela izinqubo ezilandelayo ukwakha ukuxhumana kagesi phakathi kwesendlalelo esiphezulu, ungqimba olungaphansi, nemibuthano yengqimba yangaphakathi yeBhodi; Okunye ukugcina ubuqotho bezinhlekelele nokubeka ukunemba kokufakwa kwengxenye ebhodini.
Ubumpumputhe Vias kanye ne-Vired Vias basetshenziswa kabanzi kubuchwepheshe obuphezulu bokuxhumeka (HDI) ubuchwepheshe be-PCB ye-HDI, ikakhulukazi emabhodini e-PCB aphezulu. I-Blind Vias ngokuvamile xhuma ungqimba wokuqala kungqimba lwesibili. Kweminye imiklamo, i-virible vias ingaxhuma nesendlalelo sokuqala kungqimba lwesithathu. Ngokuhlanganisa i-virible nengcwatshwe i-vias, ukuxhumeka okwengeziwe kanye neziqubu zeBhodi yesekethe eziphakeme ezidingekayo ze-HDI zingatholakala. Lokhu kuvumela ukunyuselwa kwezingqimba ezilinganayo ngamadivayisi amancane ngenkathi kuthuthukisa ukudluliselwa kwamandla. I-Viden Vias isiza ukugcina amabhodi wesifunda angasindi kahle futhi acwebile. Izimpumputhe futhi kwangcwatshwa ngemiklamo kuvame ukusetshenziswa ku-Complex-Design, kunesisindo esikhanyayo, nomkhiqizo obiza kakhulu we-elekthronikhiSmartphones, amaphilisi, kanyeAmadivayisi wezokwelapha.
Vias ayimpumputhekwakheka ngokulawula ukujula kokumba noma ukubulawa kwe-laser. Lesi sakamuva njengamanje siyindlela evamile. Ukuchithwa kwezimbobo nge-via kwakhiwa ngokulandelana okulandelana. Umphumela we-HIVE SHOVES angafakwa noma agxishwe, engeza okwengeziwe kokukhiqiza nezinyathelo zokuhlola kanye nezindleko ezandayo.
Ngokusho kwenhloso nomsebenzi wezimbobo, zingahlukaniswa ngokuthi:
Via izimbobo:
Ziyizimbobo ezihlaselwe ngensimbi ukufeza ukuxhumana kukagesi phakathi kwezendlalelo ezihlukile zokuphamba kwi-PCB, kepha hhayi ngenhloso yezinto ezikhuphukayo.
I-PS: Ngezimbobo zingahlukaniswa futhi zingene emgodini, umgodi ongcwatshwe kanye nomgodi ongaboni, kuya ngesendlalelo esingena nge-PCB njengoba kushiwo ngenhla.
Izimbobo zethango:
Zisetshenziselwa ukuthengisa kanye nokulungisa ama-plug-in electronic compacts, kanye nezimbobo ezisetshenziselwa ukuxhumana kagesi phakathi kwezendlalelo ezahlukahlukene. Izimbobo zezakhi zivame ukufakwa ngensimbi, futhi nazo zingasebenza njengamaphoyinti wokufinyelela ezixhumi.
Izimbobo ezikhuphukayo:
Ziyizimbobo ezinkulu ku-PCB esetshenziselwa ukuthola i-PCB ekuhlolweni noma kwenye isakhiwo.
Slot Holes:
Zakhiwa ngokuzenzakalela ngokuhlanganisa izimbobo eziningi noma ngokugaya ama-grooves ohlelweni lokumba lomshini. Ngokuvamile asetshenziswa njengamaphoyinti akhuphukayo wezikhonkwane ezixhunyiwe, njengezikhonkwane ezibunjwe okusaqanda zesokhethi.
Izimbobo ze-BackDrill:
Zinezimbobo ezijulile ezihlaselwe izimbobo ze-plated-nge-PCB ukuhlukanisa i-stub futhi zinciphise ukuboniswa kwesiginali ngesikhathi sokudluliselwa.
Ukulandela ezinye izimbobo ezisizayo abakhiqizi be-PCB abangazisebenzisa kuInqubo yokukhiqiza ye-PCBLowo onjiniyela be-PCB Design kufanele bajwayele:
● Ukuthola izimbobo kunezimbobo ezintathu noma ezine ngaphezulu nangaphansi kwe-PCB. Ezinye izimbobo ezisebhodini zihambisana nalezi zimbobo njengendawo yesethenjwa sezikhonkwane zokuma nokulungisa. Yaziwa nangokuthi izimbobo eziqondisiwe noma izimbobo zesikhundla okuhlosiwe, zikhiqizwa ngomshini wethagethi womshini wethagethi (umshini wokushayela we-optical punching noma umshini wokushayela i-X-ray, njll.
●Ukuqondanisa okuphakathi kwangaphakathiIzimbobo ziyizinye izimbobo onqenqemeni lwebhodi ye-multilayer, esetshenziselwa ukuthola ukuthi kukhona ukuphambuka ebhodini le-multilayer ngaphambi kokumba ngaphakathi kwebhodi. Lokhu kunquma ukuthi uhlelo lokumba ludinga ukulungiswa.
● Izimbobo zekhodi zilandelana kwezimbobo ezincane ohlangothini olulodwa lwasebhodi elisetshenziselwa ukukhombisa imininingwane yokukhiqiza, njengemodeli yomkhiqizo, i-opharetha ye-opharetha, i-Etc.
● Izimbobo ze-fiducacial zinye izimbobo zosayizi abahlukahlukene onqenqemeni lwebhodi, esetshenziselwa ukukhomba uma ububanzi be-drill bulungile ngesikhathi senqubo yokumba. Kulezi zinsuku, amafektri amaningi asebenzisa ubunye ubuchwepheshe kule nhloso.
● Amathebhu e-breakaway ayizimbobo ezisetshenziselwa ukushelela kwe-PCB kanye nokuhlaziywa ukubonisa ikhwalithi yezimbobo.
● Izimbobo zokuhlola ukungcola ziyizimbobo ezinama-plated ezisetshenziselwa ukuhlola ukungcola kwe-PCB.
● Izimbobo zokuzilingisa zivame ukugcwala izimbobo ezingekho emthethweni ezisetshenziselwa ukuvimbela ibhodi elibekwe emuva emuva, futhi zivame ukusetshenziswa endaweni yokuhlala ngesikhathi sokubumba noma izinqubo zokucabanga.
● Izimbobo zokufaka ngokuvamile zivame ukuba izimbobo ezingekho ezifuywayo ezisetshenziselwa izinqubo ezihlobene.
● Izimbobo zeRivet ziyizimbobo ezingafakwanga ezisetshenziselwa ukulungisa ama-rivets phakathi kwesendlalelo ngalunye lwezinto ezibaluleke kakhulu zephephandaba le-portilayer ngesikhathi sokuvundwa kwebhodi le-multilayer ngesikhathi sokuvundwa kwebhodi le-multilayer. Isikhundla seRivet sidinga ukudonswa ngesikhathi sokumba ukuvikela ama-bubble ukuthi angasala kuleso sikhundla, esingadala ukuqhekeka kwebhodi ngezinqubo zakamuva.
Ibhalwe ngu-Acke PCB
Isikhathi sePosi: Jun-15-2023
