Umthamo wokulethwa
| Umthamo webhodi eliqinile | |
| Inani lezendlalelo: | 1-42 izingqimba |
| Okubonakalayo: | I-FR4 \ ephezulu TG FR4 \ EHOLD Indwangu yamahhala \ CEM1 \ CEM3 \ Aluminium \ Metal |
| Ugqinsi ungqimba nzima: | 1-6oz |
| Ubukhulu obungaphakathi obuseceleni | 1-4OZ |
| Indawo ephezulu yokucubungula: | I-610 * 1100mm |
| Ubukhulu bebhodi elincane: | Izingqimba ezi-2 0.3mm (12mil) Izendlalelo ezi-4 0.4mm (16mil) 6 Izabelo 0.8mm (32mil) Izingqimba eziyi-8 1.0mm (40mil) Izendlalelo eziyi-10 1.1mm (44mil) Izendlalelo eziyi-12 1.3mm (52mil) Izendlalelo eziyi-14 1.5mm (59mil) Izendlalelo eziyi-16 1.6mm (63mil) |
| Ububanzi obuncane: | 0.076mm (3mil) |
| Isikhala esincane: | 0.076mm (3mil) |
| Ubukhulu obuncane bemigodi (umgodi wokugcina): | 0.2mm |
| Isilinganiso se-Aspect: | 10: 1 |
| Usayizi we-Drilling Hole: | 0.2-0.65mm |
| Ukubekezelela Ukubamba: | + \ - 0.05mm (2mil) |
| Ukubekezelelana kwe-Pth: | Φ0.2-1.6mm + \ - 0.075mm (3mil) Φ1.6-6.3mm + \ - 0.1MM (4mil) |
| Ukubekezelelana kwe-NPTH: | Φ0.2-1.6mm + \ - 0.05mm (2mil) Φ1.6-6.3MM + \ - 0.05mm (2mil) |
| Qeda ukubekezelela ibhodi: | Ubukhulu <0.8mm, ukubekezelela: +/- 0.08mm |
| 0.8mm≤hickness≤6.5mm, ukubekezelelana +/- 10% | |
| Ubuncane be-soldermask bridge: | 0.076mm (3mil) |
| Ukusonteka nokugoba: | ≤0.75% min0.5% |
| I-RANEG ye-TG: | 130-215 ℃ |
| Ukubekezelelana kwe-Impodence: | +/- 10%, Min +/- 5% |
| Ukwelashwa okungaphezulu:
| I-Hasl, lf hasl |
| Ukucwiliswa igolide, i-flash igolide, umunwe wegolide | |
| Isiliva yokucwilisa, i-tinsion tin, esp | |
| Ukukhetha igolide Plating, ubukhulu begolide kuze kufike ku-3um (120u ") | |
| I-Carbon Phrinta, i-S / m, eneepig | |
| Umthamo webhodi ye-aluminium | |
| Inani lezendlalelo: | Ungqimba olulodwa, izingqimba eziphindwe kabili |
| Ubukhulu bebhodi eliphakeme: | 1500 * 600mm |
| Ubukhulu bebhodi: | 0.5-3.0mm |
| Ubukhulu be-Copper: | 0.5-4OZ |
| Ubuncane be-Hole usayizi: | 0.8mm |
| Ububanzi obuncane: | I-0.1MM |
| Isikhala esincane: | I-0.12mm |
| Ubukhulu be-PAD obuncane: | I-10 micron |
| Qeda phezulu: | I-Hasl, Osp, Enig |
| Ukubumba: | CNC, punching, v-cut |
| Ukuhlinzekwa: | Umhloli we-Universal |
| Flying Probe evulekile / Umhloli Omfushane | |
| I-scross ephakeme ephezulu | |
| I-Solderability Testing Kit | |
| Umhloli wamandla we-peel | |
| I-High Volt evulekile & umhloli omfushane | |
| Isiphambano sesigaba sokubumba ikhithi nge-polisher | |
| Umthamo we-FPC | |
| Izendlalelo: | 1-8 izingqimba |
| Ubukhulu bebhodi: | 0.05-0.5mm |
| Ubukhulu be-Copper: | 0.5-3OZ |
| Ububanzi obuncane: | 0.075mm |
| Isikhala esincane: | 0.075mm |
| Ngosayizi we-hole: | 0.2mm |
| Ubuncane be-Laser Hole usayizi: | 0.075mm |
| Ubuncane be-thching hole usayizi: | I-0.5mm |
| Ukubekezelela kwe-soldermask: | + \ - 0.5mm |
| Ukubekezelelwa kwesilinganiso esiphansi: | + \ - 0.5mm |
| Qeda phezulu: | I-hasl, i-hasl ye-lf, isiliva yokucwilisa, igolide yokucwilisa, i-flash igolide, i-asp |
| Ukubumba: | Ukubhoboza, i-laser, ukusika |
| Ukuhlinzekwa: | Umhloli we-Universal |
| Flying Probe evulekile / Umhloli Omfushane | |
| I-scross ephakeme ephezulu | |
| I-Solderability Testing Kit | |
| Umhloli wamandla we-peel | |
| I-High Volt evulekile & umhloli omfushane | |
| Isiphambano sesigaba sokubumba ikhithi nge-polisher | |
| Qondisa futhi i-Flex umthamo | |
| Izendlalelo: | 1-28 izingqimba |
| Uhlobo lwezinto ezibonakalayo: | I-FR-4 (ephezulu ye-TG, i-halogen yamahhala, imvamisa ephezulu) PTFE, BT, GetEK, Aluminium Base, Copper Base, KB, KB, KB, ITEQ, Isola, Nelco, Roger, Arlon |
| Ubukhulu bebhodi: | I-6-240mil / 0.15-6.0mm |
| Ubukhulu be-Copper: | 210Um (6oz) ngesendlalelo sangaphakathi 210Um (6oz) ngesendlalelo sangaphandle |
| Min Mechanical Drill Usayizi: | 0.2mm / 0.08 " |
| Isilinganiso se-Aspect: | 2: 1 |
| Usayizi we-Max Panel: | Sigle Side noma Izinhlangothi Ezimbili: I-500mm * 1200mm |
| Izendlalelo ze-Multilayer: 508MM x 610mm (20 "x 24") | |
| Ububanzi / Isikhala se-Min: | 0.076mm / 0.076mm (0.003 "/ 0.003") / 3mil / 3mil |
| Uhlobo lweHole: | Impumputhe / Ukungcwatshwa / okuxhunyiwe (VOP, VIP ...) |
| HDI / Microvia: | Yebo |
| Qeda phezulu: | I-Hasl, lf hasl |
| Ukucwiliswa igolide, i-flash igolide, umunwe wegolide | |
| Isiliva yokucwilisa, i-tinsion tin, esp | |
| Ukukhetha igolide Plating, ubukhulu begolide kuze kufike ku-3um (120u ") | |
| I-Carbon Phrinta, i-S / m, eneepig | |
| Ukubumba: | CNC, punching, v-cut |
| Ukuhlinzekwa: | Umhloli we-Universal |
| Flying Probe evulekile / Umhloli Omfushane | |
| I-scross ephakeme ephezulu | |
| I-Solderability Testing Kit | |
| Umhloli wamandla we-peel | |
| I-High Volt evulekile & umhloli omfushane | |
| Isiphambano sesigaba sokubumba ikhithi nge-polisher | |
