I-stencil Stencil inqubo yokufaka unamathisele we-solder kuma-pads
I-PCB isungula ukuxhumana kukagesi.
Kufezwa ngento eyodwa, i-solder paste ehlanganisa insimbi ye-solder kanye ne-flux.
Imishini nezinto ezisetshenziswa kulesi sigaba ngama-laser stencil, i-solder paste namaphrinta we-solder paste.
Ukuze kuhlangatshezwane nokuhlanganisa okuhle kwe-solder, umthamo ofanele we-solder paste udinga ukuphrinta, izingxenye zidinga ukufakwa kumaphedi afanele, i-solder paste idinga ukumanzisa kahle ebhodini, futhi kufanele ihlanzeke ngokwanele ukuze i-SMT stencil. ukunyathelisa.
Usebenzisa ubuchwepheshe be-laser stencil, ungakha ama-stencil aqinile okhunini, i-plexiglass, i-polypropylene noma amakhadibhodi acindezelwe izifutho eziningi, kuye ngezidingo zakho.
Ukuze ukwazi ukudayisa izingxenye ze-SMD ebhodini lesifunda, kufanele kube nomtapo wezincwadi owanele.
Ubuso bokugcina emabhodini esekethe, njenge-HAL, ngokuvamile abanele.
Ngakho-ke, i-solder paste isetshenziswa kumaphedi wezingxenye ze-SMD.
I-paste isetshenziswa kusetshenziswa i-laser cut metal stencil.Lokhu kuvame ukubizwa ngokuthi isifanekiso noma isifanekiso se-SMD.
Gcina izingxenye ze-SMD zingasheleli ebhodini
Ngesikhathi senqubo yokushisela, abanjwe endaweni nge-adhesive.
I-adhesive ingasetshenziswa kusetshenziswa ithempulethi ye-laser-cut metal.
