Imikhiqizo
I-Industril sensor 4 layer rigid&flex pcb enethusi elingu-2oz
| Izendlalelo | 4 izendlalelo eziqinile+2 izingqimba ezigobekayo |
| Ukujiya kwebhodi | 1.60MM+0.2mm |
| Okubalulekile | FR4 tg150+Polymide |
| Ukujiya kwethusi | 1 OZ(35um) |
| I-Surface Qeda | ENIG Au Ukujiya 1um;Ubukhulu obungu-3um |
| Imbobo encane(mm) | 0.21mm |
| Ububanzi Bolayini Obuncane(mm) | 0.15mm |
| Isikhala somugqa omncane(mm) | 0.15mm |
| I-Solder Mask | Okuhlaza |
| Umbala Wenganekwane | Emhlophe |
| Ukucutshungulwa komshini | I-V-scoring, CNC Milling(umzila) |
| Ukupakisha | Isikhwama se-Anti-static |
| I-E-test | I-Flying probe noma i-Fixture |
| Izinga lokwamukela | IPC-A-600H Ikilasi 2 |
| Isicelo | Ugesi wezimoto |
Isingeniso
Ama-PC aqinile & aguquguqukayo ahlanganiswe namabhodi aqinile ukwenza lo mkhiqizo oyingxubevange.Ezinye izendlalelo zenqubo yokukhiqiza zihlanganisa isekethe eguquguqukayo egijima phakathi kwamabhodi aqinile, afanayo
idizayini yesekethe ye-hardboard ejwayelekile.
Umklami webhodi uzokwengeza ahlanganiswe ngezimbobo (ama-PTH) axhuma amasekhethi aqinile futhi aguquguqukayo njengengxenye yale nqubo.Le PCB ibidumile ngenxa yobuhlakani bayo, ukunemba, nokuvumelana nezimo.
I-Rigid-Flex PCBs yenza ukwakheka kwe-elekthronikhi kube lula ngokususa izintambo eziguquguqukayo, uxhumo, nezintambo ezingazodwana.I-Rigid&Flex boards circuitry ihlanganiswe ngokuqinile esakhiweni sonke sebhodi, esithuthukisa ukusebenza kukagesi.
Onjiniyela bangalindela ukugcinwa okungcono kakhulu nokusebenza kukagesi ngenxa yoxhumo oluqinile lwe-PCB lwangaphakathi lukagesi nolwemishini.
Okubalulekile
Izinto ze-Substrate
Into edume kakhulu eqinile-ex i-fiberglass elukiwe.Ungqimba olujiyile lwe-epoxy resin lumboza le fiberglass.
Noma kunjalo, i-fiberglass ene-epoxy-impregnated ayiqiniseki.Ayikwazi ukumelana nokushaqeka okungazelelwe futhi okuqhubekayo.
I-Polyimide
Lokhu okubalulekile kukhethwe ngenxa yokuguquguquka kwayo.Iqinile futhi ingakwazi ukumelana nokushaqeka nokunyakaza.
I-Polyimide nayo ingamelana nokushisa.Lokhu kuyenza ilungele izinhlelo zokusebenza ezinokuguquguquka kwezinga lokushisa.
I-polyester (PET)
I-PET ithandwa ngezici zayo zikagesi nokuguquguquka.Imelana namakhemikhali nokuswakama.Ngakho-ke ingase isetshenziswe ezimweni ezinzima zezimboni.
Ukusebenzisa i-substrate efanele kuqinisekisa amandla afiselekayo nokuphila isikhathi eside.Icabangela izici ezifana nokumelana nezinga lokushisa nokuzinza kobukhulu ngenkathi kukhethwa i-substrate.
I-Polyimide Adhesives
Ukunwebeka kwezinga lokushisa kwalokhu okunamathelayo kuyenza ilungele umsebenzi.Iyakwazi ukumelana no-500°C.Ukumelana nokushisa kwayo okuphezulu kuyenza ifaneleke ezinhlobonhlobo zezicelo ezibucayi.
I-Polyester Adhesives
Lezi zinamathiselo zonga kakhulu kunezinamathiselo ze-polyimide.
Zinhle kakhulu ekwenzeni amasekethe okufakazela ukuqhuma aqinile.
Ubuhlobo babo nabo bubuthakathaka.Izinamathiselo ze-polyester nazo azikwazi ukumelana nokushisa.Zibuyekezwe kamuva nje.Lokhu kubanika ukumelana nokushisa.Lolu shintsho luphinde lukhuthaze ukuzivumelanisa nezimo.Lokhu kubenza baphephe ekuhlanganiseni kwe-PCB ye-multilayer.
Izinamathiselo ze-Acrylic
Lezi zokunamathisela ziphakeme.Zinokusimama okuhle kakhulu kwe-thermal ngokumelene nokugqwala namakhemikhali.Kulula ukuzisebenzisa futhi azibizi uma kuqhathaniswa.Kuhlanganiswe nokutholakala kwazo, zithandwa phakathi kwabakhiqizi.abakhiqizi.
Ama-epoxies
Lokhu cishe ingcina esetshenziswa kakhulu ekukhiqizeni isekethe ye-rigid-flex.Angakwazi futhi ukumelana nokugqwala kanye namazinga okushisa aphezulu naphansi.
Ziyakwazi futhi nezimo ngokwedlulele futhi zinamathela ngokuqinile.Ine-polyester encane kuyo eyenza ibe lula.
Isitaki
I-stack-up ye-rigid-ex PCB ingenye yezingxenye eziningi phakathi
ukwakhiwa kwe-PCB eqinile futhi kuyinkimbinkimbi kunejwayelekile
amabhodi aqinile, ake sibheke izingqimba ezi-4 ze-PCB eqinile njengangezansi:
Imaski ephezulu ye-solder
Isendlalelo esiphezulu
I-Dielectric 1
Isendlalelo sesiginali 1
I-Dielectric 3
Isendlalelo sesiginali 2
I-Dielectric 2
Isendlalelo esingezansi
I-soldermask engezansi
PCB Amandla
| Umthamo webhodi eliqinile | |
| Inombolo yezendlalelo: | 1-42 izingqimba |
| Okubalulekile: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminium\Metal core\PTFE\Rogers |
| Ugqinsi lwe-Cu lwesendlalelo sangaphandle: | 1-6OZ |
| Ugqinsi lwe-Cu yangaphakathi: | 1-4OZ |
| Indawo ephezulu yokucubungula: | 610*1100mm |
| Ubuncane bebhodi ukujiya: | 2 izendlalelo 0.3mm (12mil) 4 izendlalelo 0.4mm (16mil) 6 izendlalelo 0.8mm (32mil) 8 izendlalelo 1.0mm (40mil) 10 izendlalelo 1.1mm (44mil) 12 izendlalelo 1.3mm (52mil) 14 izendlalelo 1.5mm (59mil) 16 izendlalelo 1.6mm (63mil) |
| Ububanzi obuncane: | 0.076mm (3mil) |
| Ubuncane besikhala: | 0.076mm (3mil) |
| Ubuncane bosayizi wembobo (imbobo yokugcina): | 0.2mm |
| Ukubukeka kwesilinganiselo: | 10:1 |
| Usayizi wembobo yokubhoboza: | 0.2-0.65mm |
| Ukubekezelela ukumba: | +\-0.05mm(2mil) |
| Ukubekezelelwa kwe-PTH: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| Ukubekezelelana kwe-NPTH: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Qedela ukubekezelela ibhodi: | Ubukhulu＜0.8mm, Ukubekezelelana:+/-0.08mm |
| 0.8mm≤Ukuqina≤6.5mm,Ukubekezelela+/-10% | |
| Ubuncane bebhuloho le-soldermask: | 0.076mm (3mil) |
| Ukusonta nokugoba: | ≤0.75% Min0.5% |
| Uhlu lwe-TG: | 130-215 ℃ |
| Ukubekezelela Impedance: | +/-10%, Amaminithi+/-5% |
| Ukwelashwa kwendawo: | HASL, LF HASL |
| Igolide lokucwiliswa, i-Flash Gold, umunwe wegolide | |
| Isiliva Sokucwiliswa, Ithini Yokucwiliswa, i-OSP | |
| I-Selective Gold Plating, ukujiya kwegolide kufika ku-3um(120u") | |
| I-Carbon Print, I-Peelable S/M, ENEPIG | |
| Aluminium board umthamo | |
| Inombolo yezendlalelo: | Isendlalelo esisodwa, izingqimba ezimbili |
| Ubukhulu bosayizi webhodi: | 1500*600mm |
| Ubukhulu bebhodi: | 0.5-3.0mm |
| Ugqinsi lwethusi: | 0.5-4oz |
| Ubuncane bosayizi wembobo: | 0.8mm |
| Ububanzi obuncane: | 0.1mm |
| Isikhala esincane: | 0.12mm |
| Ubuncane bukasayizi wephedi: | 10 micron |
| Ukuqedwa kobuso: | I-HASL, OSP, ENIG |
| Ukubumba: | CNC, Punching, V-cut |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
| Amandla we-FPC | |
| Izendlalelo: | 1-8 izendlalelo |
| Ubukhulu bebhodi: | 0.05-0.5mm |
| Ugqinsi lwethusi: | 0.5-3OZ |
| Ububanzi obuncane: | 0.075mm |
| Isikhala esincane: | 0.075mm |
| Ngosayizi wembobo: | 0.2mm |
| Ubuncane bosayizi wembobo ye-laser: | 0.075mm |
| Ubuncane bosayizi wembobo yokubhoboza: | 0.5mm |
| Ukubekezelelana kwe-Soldermask: | +\-0.5mm |
| Ubuncane bokubekezelela ubukhulu bomzila: | +\-0.5mm |
| Ukuqedwa kobuso: | I-HASL,LF HASL, Isiliva Lokucwiliswa, Igolide Lokucwiliswa, I-Flash Gold, i-OSP |
| Ukubumba: | Ukubhoboza, i-laser, ukusika |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
| Umthamo oqinile & oguqukayo | |
| Izendlalelo: | 1-28 izingqimba |
| Uhlobo lwezinto: | FR-4(High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, Aluminium base, Copper base, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Ubukhulu bebhodi: | 6-240mil/0.15-6.0mm |
| Ugqinsi lwethusi: | 210um (6oz) wesendlalelo sangaphakathi esingu-210um (6oz) sesendlalelo sangaphandle |
| Usayizi omncane wokubhoboza womshini: | 0.2mm/0.08” |
| Ukubukeka kwesilinganiselo: | 2:1 |
| Ubukhulu bosayizi wephaneli: | Uhlangothi olulodwa noma izinhlangothi ezimbili: 500mm * 1200mm |
| Izendlalelo Zezendlalelo Eziningi:508mm X 610mm (20″ X 24″) | |
| Ububanzi/isikhala somugqa omncane: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Ngohlobo lwembobo: | Impumputhe / Yangcwatshwa / Ixhunyiwe(VOP,VIP…) |
| HDI / Microvia: | YEBO |
| Ukuqedwa kobuso: | HASL, LF HASL |
| Igolide lokucwiliswa, i-Flash Gold, umunwe wegolide | |
| Isiliva Sokucwiliswa, Ithini Yokucwiliswa, i-OSP | |
| I-Selective Gold Plating, ukujiya kwegolide kufika ku-3um(120u") | |
| I-Carbon Print, I-Peelable S/M, ENEPIG | |
| Ukubumba: | CNC, Punching, V-cut |
| Izisetshenziswa: | I-Universal Tester |
| I-Flying Probe Open/Short Tester | |
| IMicroscope enamandla amakhulu | |
| Ikhithi Yokuhlola I-Solderability | |
| Peel Amandla okuhlola | |
| I-Volt Volt Ephakeme Evuliwe & Isihloli Esifushane | |
| Ikhithi yokubumba ye-Cross Section With Polisher | |
